Solar Cell and Method of Fabricating the Same

ABSTRACT

A solar cell according to the embodiment includes a plurality of back electrode patterns spaced apart from each other on a substrate; a light absorption layer including contact patterns to connect electrodes to each other and division patterns to divide cells into unit cells on the substrate formed with the back electrode patterns; top electrode patterns spaced apart from each other by the division patterns on the light absorption layer; and insulating patterns among the back electrode patterns or on the back electrode patterns. The top electrode patterns are filled in the contact patterns and electrically connected to the back electrode patterns.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.13/262,441, filed Sep. 30, 2011, which is the U.S. national stageapplication of International Patent Application No. PCT/KR2010/001989,filed Mar. 31, 2010, which claims priority to Korean Application Nos.10-2009-0027874, filed Mar. 31, 2009, and 10-2009-0027875, filed Mar.31, 2009, the disclosures of each of which are incorporated herein byreference in their entirety.

TECHNICAL FIELD

The disclosure relates to a solar cell and a method of fabricating thesame.

BACKGROUND ART

Recently, as energy consumption has been increased, a solar cell capableof converting solar energy into electric energy has been developed.

In particular, a CIGS solar cell, which is a PN hetero junction devicehaving a substrate structure including a glass substrate, a metal backelectrode layer, a P type CIGS light absorption layer, a high-resistancebuffer layer, and an N type window layer, is extensively used.

In addition, in order to fabricate such a solar cell, a mechanicalpatterning process may be performed. However, if the mechanicalpatterning is performed, the precision degree may be lowered and thedefect may occur during the patterning process.

DISCLOSURE OF THE INVENTION Technical Problem

The disclosure provides a solar cell and a method of fabricating thesame, in which cells can be efficiently connected with each otherthrough the precise patterning, a light absorption layer may have a widesurface area, and the efficiency of the solar cell can be improved.

The disclosure provides a solar cell and a method of fabricating thesame, in which coupling strength between a substrate and a backelectrode can be reinforced and the leakage current can be minimized.

Technical Solution

A solar cell according to the embodiment includes a plurality of backelectrode patterns spaced apart from each other on a substrate; a lightabsorption layer including contact patterns to connect electrodes toeach other and division patterns to divide cells into unit cells on thesubstrate formed with the back electrode patterns; top electrodepatterns spaced apart from each other by the division patterns on thelight absorption layer; and insulating patterns among the back electrodepatterns or on the back electrode patterns, wherein the top electrodepatterns are filled in the contact patterns and electrically connectedto the back electrode patterns.

A method of fabricating a solar cell according to the embodimentincludes forming a plurality of back electrode patterns spaced apartfrom each other on a substrate and forming insulating patterns among theback electrode patterns or on the back electrode patterns; forming alight absorption layer including contact patterns to connect electrodesto each other and division patterns to divide cells into unit cells onthe substrate formed with the back electrode patterns; and forming topelectrode patterns spaced apart from each other by the division patternson the light absorption layer, wherein the top electrode patterns arefilled in the contact patterns and electrically connected to the backelectrode patterns.

ADVANTAGEOUS EFFECTS

According to the solar cell and the method of fabricating the same ofthe first and second embodiments, first insulating patterns are formedon back electrode patterns, so that lower back electrode patterns can beprevented from being damaged.

In addition, the back electrode patterns are not exposed to the outsidedue to the first insulating patterns after the division patterns havebeen formed, so that the back electrode patterns can be prevented frombeing oxidized and can be protected from impurities.

In addition, since the cells are divided by a laser, a distance betweenadjacent cells can be reduced, a process can be simplified, and an areaof a light incident region can be widened.

Further, the damage caused by the mechanical stress can be reduced, sothat the efficiency of the solar cell can be improved.

According to the solar cell and the method of fabricating the same ofthe third embodiment, second insulating patterns are formed among theback electrode patterns, so that coupling strength between the backelectrode patterns and the second insulating patterns can be reinforced.

That is, since the coupling strength between the back electrode patternsand the second insulating patterns can be reinforced, the back electrodepatterns can be prevented from being delaminated from the substrate.

When the patterning process is performed by using a laser to form theback electrode patterns, an edge region of the back electrode patternsmay be delaminated or peeled off. However, according to the embodiment,the back electrode patterns can be formed without using the laser, sothat the back electrode patterns can be prevented from being deformed bythe laser patterning.

In addition, since the back electrode patterns may not be delaminated,the light absorption layer can be stably formed, so that the quality andefficiency of the solar cell can be improved.

Further, since the second insulating patterns are formed among the backelectrode patterns, the leakage current can be prevented from occurringamong the back electrode patterns.

DESCRIPTION OF THE DRAWINGS

FIGS. 1 to 10 are sectional views showing a method of fabricating asolar cell according to the first embodiment;

FIGS. 11 to 14 are sectional views showing a method of fabricating asolar cell according to the second embodiment; and

FIGS. 15 to 23 are sectional views showing a method of fabricating asolar cell according to the third embodiment.

MODE FOR INVENTION

In the description of the embodiments, it will be understood that, whena substrate, a film, an electrode, a groove or a layer is referred to asbeing “on” or “under” another substrate, another film, anotherelectrode, another groove, or another layer, it can be “directly” or“indirectly” over the other substrate, film, electrode, groove, orlayer, or one or more intervening layers may also be present. Such aposition of the layer has been described with reference to the drawings.The thickness and size of each layer shown in the drawings may beexaggerated, omitted or schematically drawn for the purpose ofconvenience or clarity. In addition, the size of elements does notutterly reflect an actual size.

FIGS. 1 to 10 are sectional views showing a method of fabricating asolar cell according to the first embodiment.

As shown in FIG. 1, a back electrode 201 is formed on a substrate 100.The substrate 100 includes a glass substrate, a ceramic substrate, suchas an alumina substrate, a stainless steel substrate, a titaniumsubstrate or a polymer substrate.

The glass substrate may include soda lime glass and the polymersubstrate may include polyimide.

The substrate 100 may be rigid or flexible.

The back electrode 201 may include a conductor such as a metal.

For instance, the back electrode 201 can be formed through a sputteringprocess by using a molybdenum (Mo) target.

The molybdenum (Mo) has high electric conductivity, superior ohmiccontact property with respect to a light absorption layer and hightemperature stability in the Se atmosphere.

In addition, although not shown in the drawings, the back electrode 201may include at least one layer.

If the back electrode 201 includes a plurality of layers, the layers maybe formed by using different materials.

In addition, as shown in FIG. 2, a plurality of first insulatingpatterns 10 are formed on the back electrode 201.

In order to form the first insulating patterns 10, an insulating layeris formed on the back electrode 201 and a patterning process isperformed with respect to the insulating layer.

The insulating layer can be formed through one of a sputtering process,a thermal deposition process, a spray process and a spin coatingprocess.

The patterning process to form the first insulating patterns 10 mayinclude a photolithography process such as a wet etching process or adry etching process.

The first insulating patterns 10 may include an insulating material or apolymer compound, which does not react with the back electrode 201 andthe light absorption layer to be formed later.

For instance, the first insulating patterns 10 may include one ofSiO_(x) (x=2 to 4), SiN_(s) (x=4), PMMA (polymethyl methacrylate),polyimide, and polypropylene.

The first insulating patterns 10 are disposed among the cells to dividethe cells from each other.

That is, each insulating pattern 10 is disposed between two adjacentcells by taking the position of the light absorption layer and the topelectrode, which will be formed later, into consideration.

Then, as shown in FIG. 3, the patterning process is performed withrespect to the back electrode 201 to form back electrode patterns 200.

The back electrode patterns 200 are aligned such that the substrate 100can be exposed through the first insulating patterns 10.

In addition, the back electrode patterns 200 can be aligned in the formof a stripe or a matrix corresponding to the cells.

However, the back electrode patterns 200 may not be limited to the aboveshape, but may have various shapes.

After that, as shown in FIG. 4, the light absorption layer 300, thefirst buffer layer 400 and the second buffer layer 500 are formed on theback electrode 201.

The light absorption layer 300 includes the Ib-IIIb-VIb group compound.

In detail, the light absorption layer 300 may include the Cu—In—Ga—Se(Cu(In,Ga)Se₂; CIGS) compound.

In contrast, the light absorption layer 300 may include the Cu—In—Se(CuInSe₂; CIS) compound or the Cu—Ga—Se (CuGaSe₂; CGS) compound.

For instance, in order to form the light absorption layer 300, a CIGmetal precursor layer is formed on the back electrode 201 by using a Cutarget, an In target or a Ga target.

The metal precursor layer reacts with Se through the selenizationprocess, thereby forming the CIGS light absorption layer 300.

In addition, while the process for forming the metal precursor layer andthe selenization process are being performed, alkali componentscontained in the substrate 100 are diffused into the metal precursorlayer and the light absorption layer 300 through the back electrodepatterns 200.

The alkali components may improve the grain size of the light absorptionlayer 300 and the crystal property.

The light absorption layer 300 receives the incident light to convertthe incident light into the electric energy. The light absorption layer300 generates the photo-electromotive force based on the photoelectriceffect.

The first buffer layer 400 can be formed by depositing CdS on the lightabsorption layer 300.

The first buffer layer 400 is an N type semiconductor layer and thelight absorption layer 300 is a P type semiconductor layer. Thus, thelight absorption layer 300 and the first buffer layer 400 may form thePN junction.

In addition, the second buffer layer 500 may be prepared as atransparent electrode layer including one of ITO, ZnO and i-ZnO.

The first and second buffer layers 400 and 500 are disposed between thelight absorption layer 300 and the top electrode to be formed later.

Since there is great difference in the lattice constant and the energybandgap between the light absorption layer 300 and the top electrode, ifthe first and second buffer layers 400 and 500 having the intermediatebandgap are interposed between the light absorption layer 300 and thetop electrode, the superior junction can be obtained.

According to the present embodiment, two buffer layers are formed on thelight absorption layer 300. However, the embodiment is not limitedthereto. For instance, only one buffer layer can be formed on the lightabsorption layer 300.

Then, as shown in FIG. 5, contact patterns 310 are formed through thelight absorption layer 300, the first buffer layer 400 and the secondbuffer layer 500.

The contact patterns 310 can be formed through laser irradiation and theback electrode patterns 200 are partially exposed through the contactpatterns 310.

At this time, the laser beam irradiated onto the second buffer layer 500may have a wavelength different from a wavelength of the laser beamirradiated onto the light absorption layer 300 and the first bufferlayer 400. In addition, the intensity of the laser beam can be adjustedthrough a lens.

Since the second buffer layer 500 has a high energy bandgap, a laserbeam having relatively high output power is used for the second bufferlayer 500. In addition, since the first buffer layer 400 and the lightabsorption layer 300 has a low energy bandgap, a laser beam havingrelatively low output power is used for the first buffer layer 400 andthe light absorption layer 300 to form the contact patterns 310.

Then, as shown in FIG. 6, a transparent conductive material is depositedon the second buffer layer 500 to form a top electrode and a connectionwire 700.

When the transparent conductive material is deposited on the secondbuffer layer 500, the transparent conductive material is filled in thecontact patterns 310 to form the connection wire 700.

The back electrode patterns 200 are electrically connected to the topelectrode 600 through the connection wire 700.

In order to form the top electrode 600, the sputtering process isperformed with respect to the second buffer layer 500 by usingaluminum-doped ZnO or alumina-doped ZnO.

The top electrode 600 is a window layer forming the PN junction withrespect to the light absorption layer 300. Since the top electrode 600serves as a transparent electrode for the solar cell, the top electrode600 is formed by using ZnO having high light transmittance and superiorelectric conductivity.

In addition, ZnO is doped with aluminum or alumina, so that the topelectrode 600 has a low resistance value.

In order to form the top electrode 600, a ZnO layer is deposited throughthe RF sputtering process using a ZnO target, the reactive sputteringusing a Zn target, or the metal organic chemical vapor deposition(MOCVD).

In addition, a dual structure can be formed by depositing an ITO (indiumtin oxide) layer having the superior electro-optical characteristic ontothe ZnO layer.

Then as shown in FIG. 7, division patterns 320 are formed through thelight absorption layer 300, the first buffer layer 400 and the secondbuffer layer 500.

The division patterns 320 can be formed through the laser irradiationsuch that the top surface of the first insulating patterns 10 can beexposed through the division patterns 320.

The laser beam used to form the division patterns 320 has a wavelengthof about 532 nm to about 1064 nm and power of about 5 W to about 20 W.

The first buffer layer 400, the second buffer layer 500 and the topelectrode 600 are separated from each other by the division patterns320. In addition, the cells C1 and C2 are separated from each other bythe first insulating patterns 10 and the division patterns 320.

Since the first insulating patterns 10 are formed on the back electrodepatterns 200, the lower back electrode patterns 200 can be preventedfrom being damaged when the laser patterning process is performed.

In addition, since the back electrode patterns 200 are not exposed tothe outside due to the first insulating patterns 10 after the divisionpatterns 320 has been formed, the back electrode patterns 200 can beprevented from being oxidized and can be protected from the impurities.

When the division patterns 320 are formed, the over etching is performedto electrically separate adjacent cells from each other, so the firstinsulating patterns 10 may be partially removed.

However, the first insulating patterns 10 may not be completely removedand the back electrode patterns 200 are not exposed.

According to the present embodiment, a width of the division patterns320 is equal to a width of the first insulating patterns 10, but theembodiment is not limited thereto. For instance, the width of thedivision patterns 320 may be smaller than the width of the firstinsulating patterns 10.

That is, as shown in FIG. 8, the division patterns 320 have a widthsufficient for dividing the cells C1 and C2 from each other, and thewidth of the first insulating patterns 10 may be larger than the widthof the division patterns 320.

In addition, as shown in FIG. 9, the width of the division patterns 320may be larger than the width of the first insulating patterns 10.

The first buffer layer 400, the second buffer layer 500, and the lightabsorption layer 300 may be aligned in the form of a stripe or a matrixby the division patterns 320.

However, the division patterns 320 may not be limited to the aboveshape, but may have various shapes.

The cells C1 and C2 including the back electrode patterns 200, the lightabsorption layer 300, the first buffer layer 400, the second bufferlayer 500 and the top electrode 600 are formed by the division patterns320. The cell C1 can be connected to the cell C2 by the connection wire700. That is, the connection wire 700 electrically connects the backelectrode patterns 200 of the second cell C2 with the top electrode 600of the first cell C1 adjacent to the second cell C2.

After that, as shown in FIG. 10, a transparent resin 800 and a topsubstrate 900 are formed on the top electrode 600.

The transparent resin 800 can be formed by performing the thermalprocess using EVA (ethylene vinyl acetate copolymer), and the topsubstrate 900 can be formed by using heat strengthened glass. Thetransparent resin 800 is filled in the division patterns 320 so that thestack structure of the first insulating patterns 10 and the transparentresin 800 can be formed on the division patterns 320.

FIGS. 11 to 14 are sectional views showing a method of fabricating asolar cell according to the second embodiment. In the followingdescription of the second embodiment, the elements and structures thesame as those of the first embodiment will be depicted with the samereference numerals and detailed description thereof will be omitted inorder to avoid redundancy.

As shown in FIG. 11, a back electrode 201 is formed on a substrate 100.

The substrate 100 includes a glass substrate, a ceramic substrate, suchas an alumina substrate, a stainless steel substrate, a titaniumsubstrate or a polymer substrate.

The back electrode 201 may include a conductor such as a metal.

Although not shown in the drawings, the back electrode 201 may includeat least one layer.

In addition, as shown in FIG. 12, a patterning process is performed withrespect to the back electrode 201 to form back electrode patterns 200.

The back electrode patterns 200 may expose the substrate 100.

The back electrode patterns 200 can be aligned in the form of a stripeor a matrix corresponding to the cells.

Then, as shown in FIG. 13, an insulating layer 5 is formed on thesubstrate 100 having the back electrode patterns 200.

The insulating layer 5 can be formed through one of a sputteringprocess, a thermal deposition process, a spray process and a spincoating process.

The insulating layer 5 may include an insulating material or a polymercompound, which does not react with the back electrode 201 and the lightabsorption layer to be formed later.

For instance, the insulating layer 5 may include one of SiO_(x) (x=2 to4), SiN_(x) (x=4), PMMA (polymethyl methacrylate), polyimide, andpolypropylene.

After that, as shown in FIG. 14, a plurality of first insulatingpatterns 10 are formed on the back electrode patterns 200.

The first insulating patterns 10 may be formed by performing aphotolithography process such as a wet etching process or a dry etchingprocess with respect to the insulating layer 5 formed on the backelectrode patterns 200.

The first insulating patterns 10 can be disposed among the cells todivide the cells from each other.

That is, each insulating pattern 10 is disposed between two adjacentcells by taking the position of the light absorption layer and the topelectrode, which will be formed later, into consideration.

The process to form the light absorption layer 300 and the top electrode600 on the first insulating patterns 10 is identical to the processshown in FIGS. 4 to 10, so the detailed description thereof will beomitted in order to avoid redundancy.

According to the solar cell and the method of fabricating the same ofthe first and second embodiments, the first insulating patterns areformed on the back electrode patterns, so the lower back electrodepatterns can be prevented from being damaged when the laser patterningprocess is performed to divide the cells.

In addition, the back electrode patterns are not exposed to the outsidedue to the first insulating patterns after the division patterns havebeen formed, so that the back electrode patterns can be prevented frombeing oxidized and can be protected from impurities.

Further, since the cells are divided by a laser, a distance betweenadjacent cells can be reduced, a process can be simplified, and an areaof a light incident region can be widened.

In addition, the damage caused by the mechanical stress can be reduced,so that the efficiency of the solar cell can be improved.

FIGS. 15 to 22 are sectional views showing a method of fabricating asolar cell according to the third embodiment.

As shown in FIG. 15, second insulating patterns 110 are formed on asubstrate 100. The substrate 100 includes a glass substrate, a ceramicsubstrate, such as an alumina substrate, a stainless steel substrate, atitanium substrate or a polymer substrate.

The glass substrate may include soda lime glass.

The substrate 100 may be rigid or flexible.

In order to form the second insulating patterns 110, an insulating layer(not shown) is formed on the substrate 100 and the patterning process isperformed with respect to the insulating layer. The substrate 100 can beexposed through the second insulating patterns 110.

The insulating layer may be formed by using photoresist. In detail, thephotolithography process is performed with respect to the photoresist toform the second insulating patterns 110.

The second insulating patterns 110 can be formed through variousmethods. For instance, the photoresist or the insulating material can beformed on the substrate 100 through the screen printing scheme, theinkjet printing scheme or the gravure printing scheme.

In addition, the photolithography process can be directly performed withrespect to the substrate 100 to partially remove the substrate 100,thereby forming the second insulating patterns 110.

The second insulating patterns 110 are formed by using the material thesame as that of the substrate 100. In detail, the second insulatingpatterns 110 may include the photoresist or the insulating material.

The second insulating patterns 110 are aligned among the back electrodepatterns by taking the position of the back electrode patterns intoconsideration.

Then, as shown in FIG. 16, the back electrode layer 201 is formed on thesubstrate 100 having the second insulating patterns 110.

The back electrode layer 201 may include a conductor such as a metal.

For instance, the back electrode layer 201 can be formed through asputtering process by using a molybdenum (Mo) target.

The molybdenum (Mo) has high electric conductivity, superior ohmiccontact property with respect to a light absorption layer and hightemperature stability in the Se atmosphere.

In addition, although not shown in the drawings, the back electrodelayer 201 may include at least one layer.

If the back electrode layer 201 includes a plurality of layers, thelayers may be formed by using different materials.

After that, as shown in FIG. 17, the back electrode patterns 200 areformed among the second insulating patterns 110 on the substrate 100.

The back electrode patterns 200 can be formed by partially removing theback electrode layer 201 such that the second insulating patterns 110can be exposed.

At this time, the back electrode layer 201 can be partially removedthrough one of the chemical mechanical polishing (CMP) process, the wetetching process, the dry etching process and the sand blast process.

The height of the second insulating patterns 110 is equal to the heightof the back electrode patterns 200.

That is, the top surface of the second insulating patterns 110 isaligned on the same plane with the top surface of the back electrodepatterns 200.

However, the height of the second insulating patterns 110 and the backelectrode patterns 200 may not be limited to the above. For instance,the height of the back electrode patterns 200 may be lower than theheight of the second insulating patterns 110.

In detail, when the back electrode layer 201 is partially removed toexpose the second insulating patterns 110, the back electrode layer 201is over-etched such that the height of the back electrode patterns 200may be lower than the height of the second insulating patterns 110.

Since the second insulating patterns 110 are aligned among the backelectrode patterns 200, the coupling strength between the back electrodepatterns 200 and the second insulating patterns 110 can be reinforced.

That is, since the coupling strength between the back electrode patterns200 and the second insulating patterns 110 can be reinforced, the backelectrode patterns 200 can be prevented from being delaminated from thesubstrate 100.

In addition, the second insulating patterns 110 may have a width smallerthan a width of the back electrode patterns 200.

In addition, the back electrode patterns 200 may be aligned in the formof a stripe or a matrix corresponding to the cells.

However, the back electrode patterns 200 may not be limited to the aboveshape, but may have various shapes.

In addition, after the second insulating patterns 110 have been formed,the back electrode patterns 200 are formed among the second insulatingpatterns 110, so the additional patterning process for the backelectrode patterns 200 may not be necessary.

When the patterning process is performed by using a laser to form theback electrode patterns 200, an edge region of the back electrodepatterns may be delaminated or peeled off.

However, according to the embodiment, the back electrode patterns can beformed without using the laser, so that the back electrode patterns 200can be prevented from being deformed by the laser patterning.

Since the back electrode patterns 200 are not delaminated, the lightabsorption layer can be stably formed in the subsequent process, so thatthe quality and the efficiency of the solar cell can be improved.

In addition, although not shown in the drawings, the second insulatingpatterns 110 may be removed after the back electrode patterns 200 havebeen formed.

The method of forming the back electrode patterns 200 on the substrate100 may not be limited to the above method.

For instance, as shown in FIG. 18, the substrate 100 is partiallyremoved to form the second insulating patterns 110 extending from thesubstrate 100 and the back electrode patterns 200 are formed among thesecond insulating patterns 110.

At this time, the second insulating patterns 110 and the substrate 100are formed by using the same material.

After that, as shown in FIG. 19, the light absorption layer 300, thefirst buffer layer 400 and the second buffer layer 500 are formed on thesubstrate 100 having the back electrode patterns 200 and the secondinsulating patterns 110.

The light absorption layer 300 includes the Ib-IIIb-VIb group compound.In detail, the light absorption layer 300 may include the Cu—In—Ga—Se(Cu(In,Ga)Se₂; CIGS) compound.

In contrast, the light absorption layer 300 may include the Cu—In—Se(CuInSe₂; CIS) compound or the Cu—Ga—Se (CuGaSe₂; CGS) compound.

For instance, in order to form the light absorption layer 300, a CIGmetal precursor layer is formed on the back electrode 201 by using a Cutarget, an In target or a Ga target.

The metal precursor layer reacts with Se through the selenizationprocess, thereby forming the CIGS light absorption layer 300.

In addition, while the process for forming the metal precursor layer andthe selenization process are being performed, alkali componentscontained in the substrate 100 are diffused into the metal precursorlayer and the light absorption layer 300 through the back electrodepatterns 200.

The alkali components may improve the grain size of the light absorptionlayer 300 and the crystal property.

The light absorption layer 300 receives the incident light to convertthe incident light into the electric energy. The light absorption layer300 generates the photo-electromotive force based on the photoelectriceffect.

At this time, since the second insulating patterns 110 are formed amongthe back electrode patterns 200, the leakage current can be preventedfrom occurring among the back electrode patterns 200.

The first buffer layer 400 can be formed by depositing CdS on the lightabsorption layer 300.

The first buffer layer 400 is an N type semiconductor layer and thelight absorption layer 300 is a P type semiconductor layer. Thus, thelight absorption layer 300 and the first buffer layer 400 may form thePN junction.

In addition, the second buffer layer 500 can be formed by performing thesputtering process using the ZnO target.

The first and second buffer layers 400 and 500 are disposed between thelight absorption layer 300 and the top electrode to be formed later.

Since there is great difference in the lattice constant and the energybandgap between the light absorption layer 300 and the top electrode, ifthe first and second buffer layers 400 and 500 having the intermediatebandgap are interposed between the light absorption layer 300 and thetop electrode, the superior junction can be obtained.

Then, as shown in FIG. 20, contact patterns 310 are formed through thelight absorption layer 300, the first buffer layer 400 and the secondbuffer layer 500.

The contact patterns 310 can be formed through the mechanical patterningor the laser irradiation.

The back electrode patterns 200 are partially exposed through thecontact patterns 310.

After that, as shown in FIG. 21, a transparent conductive material isdeposited on the second buffer layer 500 to form a top electrode and aconnection wire 700.

When the transparent conductive material is deposited on the secondbuffer layer 500, the transparent conductive material is filled in thecontact patterns 310 to form the connection wire 700.

The back electrode patterns 200 are electrically connected to the topelectrode 600 through the connection wire 700.

In order to form the top electrode 600, the sputtering process isperformed with respect to the second buffer layer 500 by usingaluminum-doped ZnO or alumina-doped ZnO.

The top electrode 600 is a window layer forming the PN junction withrespect to the light absorption layer 300. Since the top electrode 600serves as a transparent electrode for the solar cell, the top electrode600 is formed by using ZnO having high light transmittance and superiorelectric conductivity.

In addition, ZnO is doped with aluminum or alumina, so that the topelectrode 600 has a low resistance value.

In order to form the top electrode 600, a ZnO layer is deposited throughthe RF sputtering process using a ZnO target, the reactive sputteringusing a Zn target, or the metal organic chemical vapor deposition(MOCVD).

In addition, a dual structure can be formed by depositing an ITO (indiumtin oxide) layer having the superior electro-optical characteristic ontothe ZnO layer.

Then as shown in FIG. 22, division patterns 320 are formed through thelight absorption layer 300, the first buffer layer 400 and the secondbuffer layer 500.

That is, the division patterns 320 can be formed through the topelectrode 600, the light absorption layer 300, the first buffer layer400 and the second buffer layer 500.

In addition, the division patterns 320 can be formed through themechanical patterning or the laser irradiation.

The back electrode patterns 200 are partially exposed through thedivision patterns 320.

The first buffer layer 400, the second buffer layer 500 and the topelectrode 600 are separated from each other by the division patterns320. In addition, the cells C1 and C2 are separated from each other bythe division patterns 320.

The first buffer layer 400, the second buffer layer 500 and the lightabsorption layer 300 are aligned in the form of a stripe or a matrix bythe division patterns 320.

The division patterns 320 may not be limited to the above shape, but mayhave various shapes.

The cells C1 and C2 including the back electrode patterns 200, the lightabsorption layer 300, the first buffer layer 400, the second bufferlayer 500 and the top electrode 600 are formed by the division patterns320. The cell C1 can be connected to the cell C2 by the connection wire700. That is, the connection wire 700 electrically connects the backelectrode patterns 200 of the second cell C2 with the top electrode 600of the first cell C1 adjacent to the second cell C2.

After that, as shown in FIG. 23, a transparent resin 800 and a topsubstrate 900 are formed on the top electrode 600.

The transparent resin 800 can be formed by performing the thermalprocess using EVA (ethylene vinyl acetate copolymer), and the topsubstrate 900 can be formed by using heat strengthened glass.

As described above, according to the solar cell and the method offabricating the same of the third embodiment, second insulating patternsare formed among the back electrode patterns, so that coupling strengthbetween the back electrode patterns and the second insulating patternscan be reinforced.

That is, since the coupling strength between the back electrode patternsand the second insulating patterns can be reinforced, the back electrodepatterns can be prevented from being delaminated from the substrate.

When the patterning process is performed by using a laser to form theback electrode patterns, an edge region of the back electrode patternsmay be delaminated or peeled off However, according to the embodiment,the back electrode patterns can be formed without using the laser, sothat the back electrode patterns can be prevented from being deformed bythe laser patterning.

In addition, since the back electrode patterns may not be delaminated,the light absorption layer can be stably formed, so that the quality andefficiency of the solar cell can be improved.

Further, since the second insulating patterns are formed among the backelectrode patterns, the leakage current can be prevented from occurringamong the back electrode patterns.

What is claimed is:
 1. A solar cell apparatus comprising: a plurality ofback electrodes spaced apart from each other on a substrate; a lightabsorption layer including division gaps to divide cells into aplurality of unit cells on the substrate formed with the backelectrodes; top electrodes spaced apart from each other by the entiredivision gaps on the light absorption layer; and an insulator comprisinginsulating material on the back electrodes, wherein the light absorptionlayer further includes a plurality of contact gaps, wherein the topelectrodes are filled in the contact gaps and electrically connected tothe back electrodes, wherein an upper surface of the insulator is lowerthan an upper surface of the light absorption layer, wherein the uppersurface of the insulator is the surface of the insulator farthest awayfrom the substrate, and the upper surface of the light absorption layeris the surface of the light absorption layer farthest away from thesubstrate, wherein each unit cell includes a contact gap of theplurality of contact gaps, and wherein, within each unit cell, a portionof the light absorption layer is disposed between the contact gap and anadjacent division gap, in a first direction parallel to a top surface ofthe substrate.
 2. The solar cell apparatus of claim 1, wherein ashortest distance between the top electrode of a given unit cell and thetop electrode of an adjacent unit cell, taken in the first direction, isthe same as a shortest distance between the light absorption layer of agiven unit cell and the light absorption layer of an adjacent unit cell,taken in the first direction.
 3. The solar cell apparatus of claim 1,wherein the light absorption layer is disposed between the frontelectrode layer and the insulator such that the front electrode layer iscompletely physically separated from the insulator.
 4. The solar cell ofclaim 1, wherein the insulator is disposed on the back electrodes withinthe division gaps.
 5. The solar cell of claim 1, wherein the insulatorincludes one of SiO_(x) (x=2 to 4), SiN_(x) (x=4), PMMA (polymethylmethacrylate), polyimide, and polypropylene.
 6. The solar cell of claim1, wherein a thickness of the insulator is smaller than a thickness ofthe light absorption layer.
 7. The solar cell of claim 1, wherein thedivision gaps have a width equal to or larger than a width of theinsulator.
 8. The solar cell of claim 1, wherein a thickness of the backelectrodes is equal to a thickness of the insulator.
 9. The solar cellof claim 1, wherein a thickness of the back electrodes is smaller than athickness of the insulator.
 10. The solar cell of claim 1, wherein theinsulator and the substrate are formed by using a same material.